Mechanical and temperature resilience of multi-material systems for printed electronics packaging
نویسندگان
چکیده
منابع مشابه
High Temperature Electronics Packaging
Materials and processes are being developed for packaging of low and medium power, high temperature electronics (up to 500). Ceramic (Al2O3 and AlN) hermetic packages are being used. Die attach techniques based on patterned Au bumps, Au-Si and off-eutectic Au-Sn have been demonstrated. Au thermosonic wire bonding provides a monometallic interconnect system between the die and the package pads. ...
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ژورنال
عنوان ژورنال: Flexible and Printed Electronics
سال: 2019
ISSN: 2058-8585
DOI: 10.1088/2058-8585/ab38e9